Power density is no longer
a byproduct of performance —
it is the central challenge
As chiplet architectures, heterogeneous integration, and System-in-Package (SiP) technologies continue to compress capability into smaller geometries, the thermal complexity they generate has outpaced conventional test and qualification methodologies. iTest HiRel has built its engineering foundation around this reality — rooted in years of accumulated intellectual property, proprietary methodologies, and hard-won application knowledge across aerospace, defense, space, and high-performance computing programs.
Our Offerings
Ultra-high power burn-in platforms
Burn-in board and fixture design engineered specifically for devices operating at extreme power densities — with thermal management architectures that maintain stable junction temperatures across full-stress screening profiles.
Thermal simulation & power path modeling
Proprietary simulation methodologies model thermal behavior, power path dynamics, and electrical performance as an integrated system — identifying failure risks before hardware is built and before program schedules are at risk.
High-power fixture & hardware design
Custom fixture and load board development for devices where power dissipation and thermal stability are primary design constraints — not secondary considerations addressed after electrical performance is locked.
Thermal characterization & mapping
Full thermal characterization across operating conditions — junction-to-case, junction-to-board, and package-level thermal resistance measured and mapped against simulation predictions for complete validation confidence.
Reliability screening under thermal stress
HALT, HASS, thermal cycling, and burn-in executed with thermal profiles calibrated to actual operating environments — not generic tables. Screening designed to activate the failure modes that matter in the field.
System-level thermal qualification
Every design decision is made with measurement accuracy, calibration traceability, and correlation in mind — from device under test to probe tip, socket interface, instrumentation, and system environment.
The Process
01
Power profile definition
Device power profile, operating envelope, and mission environment are defined precisely — establishing the thermal boundary conditions that all subsequent design and simulation work is engineered around.
02
Integrated thermal modeling
Thermal behavior, power path dynamics, signal integrity, and electrical performance are modeled simultaneously — resolving design risks and validating performance margins before hardware enters fabrication.
03
Fixture & platform build
Burn-in boards, high-power fixtures, and characterization platforms are engineered with thermal management as a primary design constraint — not a secondary adjustment made after electrical layout is complete.
04
Thermal mapping & measurement
Junction-to-case, junction-to-board, and package-level thermal resistance measured across operating conditions and correlated against simulation predictions — establishing full characterization confidence.
05
Reliability screening
HALT, HASS, thermal cycling, and burn-in executed with thermal stress profiles calibrated to the actual mission environment — activating the failure modes that matter in the field, not the ones that are easiest to test.
06
System-level qualification
Thermal performance validated at device, board, and system level — integrated with signal integrity, power integrity, and electrical characterization into a unified qualification package built for deployment confidence.
