Reliability is no longer
a component characteristic —
it is application-defined
The semiconductor industry has fundamentally changed. Advanced packaging, heterogeneous integration, chiplet architectures, AI accelerators, hyperscale computing platforms, and mission-critical aerospace systems have introduced levels of complexity that traditional qualification methodologies were never designed to address. At iTest HiRel, we bring a modern and intelligent approach to product qualification that extends far beyond conventional reliability testing.
Our Offerings
Accelerated life testing & burn-in
Burn-in, accelerated life testing, and intelligent acceleration models executed with voltage and temperature techniques that compress qualification timelines without sacrificing insight into long-term device behavior and failure mechanisms.
Thermal cycling & environmental screening
Thermal cycling, temperature-humidity-bias testing, HAST, environmental stress screening, and power cycling — all calibrated to actual application stress profiles rather than generic qualification tables inherited from legacy standards.
Application-specific stress testing
Mission-profile validation and application-specific stress testing designed around the real operating conditions the device will encounter — incorporating system architecture, power density, duty cycles, and end-user deployment profiles.
Board-level & subsystem qualification
Board-level reliability assessment and subsystem qualification that evaluate not just the silicon, but the package, assembly process, board-level interactions, thermal architecture, and operational environment as an integrated system.
Intelligent qualification planning
Qualification strategies incorporating wafer-level process data, foundry characterization, package technology benchmarks, historical IP performance, field-use conditions, and system-level operating profiles — providing meaningful insight with limited sample quantities.
Failure analysis & real-time monitoring
Comprehensive failure analysis, real-time stress monitoring, technology benchmarking, and package reliability assessment — identifying potential reliability risks before they become costly field failures across any production lifecycle stage.
The Process
01
Qualification planning
Technology maturity, sample quantities, market urgency, and application requirements are assessed — producing a qualification strategy that is right-sized for the program, not generalized from a prior engagement.
02
Wafer & foundry data review
Wafer-level process data, foundry characterization, package benchmarks, and historical IP performance are incorporated — informing acceleration models and qualification logic before a single stress test begins.
03
Multi-perspective stress testing
Accelerated life testing, thermal cycling, burn-in, HAST, and application-specific stress executed simultaneously across device, package, board, and subsystem levels — driven by the mission profile, not the standard table.
04
Failure analysis & root cause
Comprehensive failure analysis on any observed failures — identifying root cause, failure mechanism, and corrective action pathway before the qualification data package is assembled or the program advances.
05
Mission-profile simulation
Mission-profile simulation and statistical methodology validate that qualification results are representative of real-world field performance — not an artifact of the test configuration or stress sequence chosen.
06
Qualification package & release
A complete qualification data package delivered with full traceability — providing customers with a true understanding of how their technology will perform throughout its intended lifecycle in the field.
