Engineering infrastructure built for the technologies that push the limits of integration
The most advanced semiconductor technologies in the world don't fail because of bad ideas — they fail because the engineering infrastructure around them wasn't ready. Chiplet architectures, heterogeneous integration, 2.5D and 3D packaging, ultra-high-density interconnects, and System-in-Package (SiP) designs operate at a level of complexity where thermal behavior, signal integrity, power integrity, materials interactions, and long-term reliability must all be managed simultaneously — from day one.
Our Offerings
Advanced packaging & hardware design
Custom load board development, substrate-level design review, and interconnect architecture analysis — engineered for chiplet, SiP, and heterogeneous integration platforms operating at the limits of integration.
Thermal & signal integrity management
Simultaneous analysis of thermal behavior, signal integrity, and power integrity across complex 2.5D and 3D packaging architectures. Failure risks identified before they become program risks.
Wafer sort & burn-in screening
High-volume and high-mix wafer sort and burn-in solutions tailored for advanced nodes. Screening methodologies calibrated to the materials systems and mission environments your device will actually encounter.
ESD characterization & latch-up validation
Full ESD qualification including HBM, CDM, and MM models alongside latch-up testing — validated against IEC and JEDEC standards, with extended characterization for radiation-tolerant and space-grade applications.
Reliability screening & environmental testing
HALT, HASS, thermal cycling, mechanical shock and vibration, and humidity exposure — designed around the actual operating profile of the mission environment, not generic qualification tables.
System-level qualification
End-to-end qualification programs integrating device-level, board-level, and system-level testing. Qualification frameworks built specifically for aerospace, defense, space, AI, and high-performance computing programs.
The Process
01
Program intake
We begin by understanding your business from the inside: your goals, current customers, competitive context, and the assumptions your team holds about where the device sits in the market and mission environment.
02
Interconnect & packaging audit
We audit device architecture, substrate design, interconnect technology, and materials systems — mapping the intricate relationships that determine thermal behavior, signal integrity, and long-term reliability.
03
Risk identification
We identify failure risks before they become program risks. Every potential failure mode is catalogued against the actual operating environment — not a generalized assumption about what the device might encounter.
04
Custom load board design
Probe cards, load boards, EST fixtures, and latch-up hardware are not afterthoughts — they are precision-engineered platforms designed specifically for each device architecture. iTest HiRel designs all test hardware with best-possible signal integrity, optimal power dissipation, minimized stray capacitance, and full pre-build simulation. Every fixture is validated to ensure that the hardware itself does not introduce error, noise, or thermal anomaly into the measurement — so the qualification data reflects the device, not the test setup.
05
Full qualification execution
Reliability screening, environmental testing, and system-level qualification executed as an integrated, application-driven sequence — not a generic checklist. Level 1 qualification is conducted at the chip level; Level 2 at the subsystem or card level. Stress profiles, thermal excursions, and environmental conditions are defined by the specific application environment and target market — whether defense ground, airborne, space, or infrastructure. The qualification program is tailored to how and where the device will actually be deployed, so every test adds program value and no critical failure mode is missed.
06
Statement validation & release
Qualification data reviewed and validated against competitive landscape and audience criteria. The qualification package is released only when it is useful, honest, and defensible enough to be sustained in the field.
