Far beyond traditional
functional testing —
the expertise behind the equipment
Modern semiconductor devices demand far more than traditional functional testing. Ultra-high pin counts, advanced packaging, AI accelerators, hyperscale computing platforms, secure communications systems, RF devices, and mission-critical aerospace applications require sophisticated test environments capable of validating performance, reliability, and manufacturability under real-world operating conditions. At iTest HiRel, what truly differentiates us is not the equipment — it is the expertise behind it.
Our Offerings
First-silicon characterization
Comprehensive first-silicon characterization programs that validate design intent, identify silicon bring-up issues, and establish the parametric baseline from which production test programs are derived — compressing early-stage development timelines.
Wafer sort & final test
Wafer sort, final test, and high-volume production test solutions developed with production-optimization methodologies — multisite execution, yield improvement analysis, and manufacturing deployment expertise built into every test program.
Test program development
End-to-end test program development transforming complex silicon designs into robust, production-ready test solutions — developed by engineers with decades of experience in characterization, production optimization, and manufacturing deployment.
Qualification & reliability test
ATE-integrated qualification and reliability testing that maintains the electrical test environment throughout the qualification flow — enabling tighter correlation between qualification stress data and production test performance.
Multisite test & yield optimization
Multisite test configuration, parallel execution optimization, and systematic yield improvement programs — translating characterization data into production test strategies that maximize throughput without sacrificing test coverage or measurement fidelity.
RF & mixed-signal test
Advanced RF characterization, mixed-signal test, and millimeter-wave measurement — covering the full signal path from baseband through RF for communications, radar, and high-frequency applications across aerospace, defense, and commercial programs.
The Process
01
Program intake & scoping
Device architecture, performance targets, test coverage requirements, production volumes, and schedule constraints are defined — establishing the test strategy and engagement model before a single line of test code is written.
02
Test program development
Test program development transforming device specifications and design intent into a structured, executable test plan — leveraging decades of ATE expertise to build test solutions that are measurement-accurate, production-scalable, and correlation-ready from day one.
03
First-silicon characterization
Full parametric and functional characterization on first silicon — validating design intent, mapping performance distributions, identifying bring-up anomalies, and establishing the characterization data set that informs production test guard-banding and limit-setting decisions.
04
Wafer sort execution
Wafer sort executed against characterized limits with multisite configuration optimized for the device architecture — inline yield monitoring, bin analysis, and early-warning flag detection built into the sort flow to catch process excursions before they propagate.
05
Yield & production optimization
Systematic yield improvement analysis — correlating test data, characterization distributions, and process variation to identify test escapes, over-test risk, and limit optimization opportunities before the program transitions to high-volume production.
06
High-volume production & deployment
High-volume production test executed with full manufacturing controls — SPC monitoring, real-time yield dashboards, and engineering support on standby throughout the production run, from first lot through mission-critical deployment.
